Hybrid PCB | Mixed Material 4-Layer PCB Made On 20 mil RO4350B + FR4 With Blind Via
(PCBs are custom-made products; the images and parameters shown are for reference only)
Introduction
Hello Everyone,
Continuing from our last article, today we will discuss the mixed material PCB made with 20 mil RO4350B and FR-4.In most cases, the high-frequency material plays a crucial role in signal transmission.Let’s have a look the stack-up.
The stack-up consists of a core made of 20 mil (0.508mm) RO4350B high-frequency material for layers 1 and 2, where the signal transmission lines are located on the first layer of copper. Layers 3 and 4 consist of an epoxy glass material. These two cores are bonded together with a sheet of adhesive (prepreg).
Basic Specifications
Base Material |
RO4350B 0.508 mm + FR4 0.6 mm + PP 0.306 mm |
Layer Count |
4 layers |
Panel Size |
75 mm x 82 mm = 1 type = 1 piece |
Surface Finish |
Immersion gold |
Copper Weight |
Outer layer 70 μm / Inner layer 35 μm |
Solder Mask / Legend |
Green / White |
Final PCB Height |
1.6 mm |
Standard |
IPC 6012 Class 2 |
Packing |
20 panels packaged for shipment |
Lead Time |
10 working days |
Shelf Life |
6 months |
Features and Benefits
1) The temperature coefficient of dielectric constant is among the lowest of any circuit board material, making it ideal for temperature sensitive applications;
2) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;
3) Signal integrity performance improvement over the stack-ups with all FR4 board;
4) ISO9001, ISO14001, IATF16949, UL Certified factory
5) Prototype to mass production capability
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Applications
Mixer,Radar Data Acquisition Converter,Spread Spectrum,Duplexer
Parameter and Data Sheet
PCB SIZE |
125mm x 125mm = 1 type = 1 piece |
BOARD TYPE |
Multlayer PCB |
Number of Layers |
4 Layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
Copper -----Top Layer 0.070mm (2 oz) |
RO4350B 0.508 mm |
|
Copper -----Plain 0.035 mm |
|
Prepreg 2113 X 3, 0.306mm |
|
Copper -----Plain 0.035 mm |
|
FR-4 0.6mm |
|
Copper ------- Bottom Layer 0.070mm (2oz) |
|
TECHNOLOGY |
|
Minimum Trace and Space: |
5.5 mil / 7.2 mil |
Minimum / Maximum Holes: |
0.4 mm / 5.7 mm |
Number of Different Holes: |
15 |
Number of Drill Holes: |
172 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
NA |
Impedance Control: |
N/A |
Number of Gold finger: |
N/A |
BOARD MATERIAL |
|
Glass Epoxy: |
RO4350B Tg280℃, er<3.48, Rogers Corp.; FR-4 IT158, ITEQ |
Final foil external: |
2.0 oz |
Final foil internal: |
1.0 oz |
Final height of PCB: |
1.6 mm ±10% |
PLATING AND COATING |
|
Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Both Top and Bottom sides |
Solder Mask Color: |
Green |
Solder Mask Type: |
LPI, Taiyo PSR-2000GT600D |
CONTOUR/CUTTING |
Routing |
MARKING |
|
Side of Component Legend |
Top and bottom side |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
|
Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |